Project general information Project: Components’ assembly and interconnection through combined solderless technologies – COMPACT Finaciar support: The Executive Unit for Financing Higher Education, Research, Development and Innovation (UEFISCDI); European Commission through ERANET MANUNET programme Project type: ERANET Contract number: 153/2020 Period: 2020 – 2022 Project COMPACT project aims to develop a new manufacturing technology method to build electronic modules withou
