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Components’ assembly and interconnection through combined solderless technologies – COMPACT
Project general information Project: Components’ assembly and interconnection through combined solderless technologies – COMPACT Finaciar support: The Executive Unit for Financing Higher Education, Research, Development and Innovation (UEFISCDI); European Commission through ERANET MANUNET programme Project type: ERANET Contract number: 153/2020 Period: 2020 – 2022 Project COMPACT project aims to develop a new manufacturing technology method to build electronic modules withou
hvalkanov3
May 20, 20214 min read
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